N, an ultra-rugged AI computing platform for autonomous applications in harsh industrial environments, delivering up ...
Visual Semiconductor, Inc. (VSI) and INCERGO to present GF3D Immersive Glasses-Free 3D, a display technology for immersive viewing across six product categories, at CES 2027. The categories are ...
Princeton University held its annual Celebrate Princeton Innovation event on October 21, 2026, showcasing research ...
The Ohio State University has expanded semiconductor processing, device prototyping and testing through its more than $20 ...
Taiwan King Lung Chin PTC Co., Ltd. (KLC Corporation) has highlighted its Thermal Test Vehicle (TTV) solutions for chip-wafer layout design and ...
Wolfspeed, Inc. has commercially introduced its proprietary transparent silicon carbide (TSiC™) technology for ...
Murata Manufacturing Co., Ltd. has signed a three-year strategic partnership with Accenture to accelerate manufacturing ...
Neuranics and Hprobe have partnered to use automated wafer probing technology for TMR (Tunnel Magnetoresistance) sensor ...
TrendForce forecasts global OLED notebook shipments will grow more than 40% year over year in 2027, following Apple's new ...
SambaNova, an AI chip company focused on inference, announced a partnership with Emergys, a digital transformation services ...
Kontron is collaborating with NOFFZ Technologies on automated testing and quality assurance for its 5G communication modules ...
BrainChip has launched the AKD1500 Raspberry Pi 5 Development Kit, which pairs Raspberry Pi 5 with an AKD1500 M.2 board for ...
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