Physics-based analysis becomes more consequential as chips, packages, boards, and systems are designed together.

Shift left is becoming less linear. Instead of locking down specifications early, design teams may be able to refine ...

The multiple demands of 3D NAND to enable yield and performance increase in difficulty at each generation. First generation devices, at 24-32 layer pairs, pushed process tools to extremes, going ...

Solving difficult bugs while intelligently deciding what to investigate, what to rerun, and where to spend compute.

Advanced packaging requires models to cross company boundaries without exposing proprietary processes, but hiding too much ...

STCO for heterogeneous design; physical AI interactions; signing off AI-generated designs; workload profile analysis.

Researchers at Chinese Academy of Sciences, Jilin University, State Key Laboratory of Advanced Manufacturing for Optical ...

Pinpointing failures, ensuring known-good optical engines, and controlling test costs become increasingly critical as ...

Two devices operating at exactly the same voltage, frequency, and temperature can behave differently depending on what they ...

Because foundries are oversubscribed, OSATs are also fully utilized, which favors ROI. “The sector is constrained by ...

An analytics-driven approach leveraging integrated industry leading technologies targeting advanced node devices.

Researchers at Arizona State University and University of Maryland published “SEAL: Multitenant Security-Aware Layer Mapping for Heterogeneous 3-D CiM Accelerators.” Abstract: “Heterogeneous 3-D ...